Apple testing vapour chamber thermal tech for next-gen iPhone, Kuo says

Apple Testing Vapour Chamber Thermal Ming-Chi Kuo

In a report published on Friday, renowned TF International Securities analyst Ming-Chi Kuo claimed that recent market studies show Apple is “aggressively” Apple testing vapour chamber thermal systems for use in the iPhone, indicating that the technology will soon be incorporated into the company’s flagship device.
Though it’s unclear if the system will be completed in time for 2021, according to Kuo, Apple is quite likely to include vapour chamber technology into a future iPhone generation.

Apple Testing Vapour Chamber Thermal Ming-Chi Kuo

In general, vapour chamber (VC) technology entails the evaporation of a liquid (usually water) inside a particular heat pipe or heat retention structure that weaves through a device chassis. The liquid evaporates into a vapour that spreads thermal energy throughout the evaporation chamber as it moves to locations of lower pressure due to heat from processors and other high load electronic components. The heat is removed from the vapour by fins or other condenser bodies. The vapour then transforms back into a liquid and is drawn back to high pressure locations by capillary action.

Apple has apparently been developing VC systems for some years, but preliminary results have fallen short of the organization’s exacting standards.

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Due to reliability test results that fall short of Apple’s strict standards, Kuo claims that the iPhone is unable to implement VC. Despite this, we remain hopeful about the VC reliability improvement timeline and anticipate that in the near future, at the very least, high-end iPhone models will come with VC.

According to Kuo, the iPhone will require VC to keep up with the quick uptake of 5G and rising CPU thermal loads. The first iPhones to handle 5G communications, the Apple iPhone 12 series, are known to heat up while connected to the super-fast network. The tech giant will be able to maintain its lead over the smartphone pack by increasing compute performance and lengthening component lifespan with the help of an enhanced thermal system.

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